Shrink-Kon® TBFP9-2
Send Print Share
  1. pin-int

Shrink-Kon® TBFP9-2

Shrink-Kon® TBFP9-2 Smooth Finish Putty Sealing Compound

  • Manufacturer: ABB
  • MFR Part #: TBFP9-2
  • Revere Part #: 1255314
  • UPC: 786210978697
  • UNSPSC: 39121721
  • Min Order Qty: 1
  • Qty. Interval: 1
  • Availability: loading Branch Available

Shrink-Kon® Putty Sealing Compound, Smooth Finish, Composition: Modified Silicone Rubber Compound, 80 deg C, 1200 psi Tensile Strength

Composition : Modified Silicone Rubber Compound
Temperature Rating : 80 deg C
Tensile Strength : 1200 psi
Type : Smooth Finish
  • Smooth filler putty compound available for use under tape when insulating bolted or dimensionally inconsistent splices and terminations
  • Repair deteriorated insulation on cables and conductors
  • Insulate and seal underwater, underground and above ground bonding installations
  • Modified silicone rubber compound
  • 20 mil to 600 vpm, 40 mil to 400 vpm dielectric strength, 110 lb-in abrasion resistance 600 VAC voltage rating
  • <0.5% water absorption
  • 25.4 mm inner Dia before heat-shrink, 635 mm L
  • pdf Specification Sheet https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/IDW_DOCUMENT_77982827a9fa6a3efd5b9f6719f1013e1dafe2d9eb29bd6c27395fdb5a2c2b1c.pdf
  • pdf SDS https://externalassets.unilogcorp.com/ASSETS/DOCUMENTS/ITEMS/EN/IDW_DOCUMENT_ea974857cf3c7d59dc5e1003620f7162af9672c58ed9b86a74fbd35eb2bfae2b.pdf